Cell Manufacturing Process Introduction |
▸Wafer Clean: |
Using acid or alkali liquid to do saw damage removal. |
▸Texturing: |
Using acid or alkali liquid to texture. |
▸Diffusion: |
High temperature vacuum tube process with (POCl3 ) gas to define positive/ negative electric junctions. |
▸Wet Edge Isolation: |
Using Acid liquid to remove SiO2 layer from wafer surface and doing isolation on wafer edge. |
▸Chemical Vapor Deposition: |
Chemical vapor deposition by tube to build anti-reflection layer (SiNx) on wafer surface. |
▸Laser Opening: |
The formation of a high-quality local back-surface-field (LBSF) using by laser opening. |
▸Screen Printing: |
Screen printing the electrode pattern on both side with metal component paste. |
▸Co-Firing: |
Using high temperature heater to make cross-link between electrode and junction for electric current output. |
▸Efficiency Test : |
Classify cells by surface visual inspection with AOI and electricity with IV-tester. |
Cell Manufacturing Process Introduction